Fully automated hot embossing processes utilizing high resolution working stamps

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DOIResolve DOI: http://doi.org/10.1016/j.mee.2009.11.098
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TypeArticle
Journal titleMicroelectronic Engineering
ISSN0167-9317
1873-5568
Volume87
Pages10371040
Subjecthot embossing; soft working stamps; de-embossing; spin-on layer; high resolution
Abstract
Publication date
PublisherElsevier
LanguageEnglish
AffiliationNational Research Council Canada; NRC Industrial Materials Institute
Peer reviewedYes
NPARC number23002043
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Record identifier40c53f07-bc23-4a48-9d1e-bf6ce6176d07
Record created2017-07-27
Record modified2017-07-27
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