All-optical elastic characterization of silicon wafers and cantilevers beams by vibration modes

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Proceedings titleQuantitative Nondestructive Evaluation
Series titleAIP Conference Proceedings; no. 820
ConferenceThe 32th Annual Review of Progress in Quantitative Nondestructive Evaluation, July 31 - August 05 2005, Brunswick, Maine, USA
Pages15851592; # of pages: 8
AbstractAn all-optical technique is developed to determine elastic parameters of both semiconductor wafers and cantilever beams through optical excitation and detection of vibration modes. Resonance frequency measurements of these modes are used to determine the materials Young’s modulus and Poisson’s ratio. The technique is remote, non-destructive and works on-line, making it an attractive inspection tool for use in semiconductor foundries and MEMS industries. Experimental results are compared with the values calculated by the theory of elasticity.
Publication date
AffiliationNational Research Council Canada (NRC-CNRC); NRC Industrial Materials Institute
Peer reviewedYes
NRC number48844
NPARC number15877974
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Record identifier98ffbbca-a973-43df-8c76-de18b43b83a8
Record created2010-07-30
Record modified2016-05-09
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