Electromechanical Analysis of a Piezoelectric Instrumented Composite Bonded Repair Patch
Electromechanical Analysis of a Piezoelectric Instrumented Composite Bonded Repair Patch
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Affiliation |
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Format | Text, Article |
Conference | The Third Canadian International Composites Conference (CANCOM 2001) From 8/21/2001 To 8/24/2001 |
Subject | Piezoelectric sensors; bonded repairs; finite element analysis; Adhesive bondline moniotiring |
Access condition |
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Peer reviewed | Yes |
NRC number | SMPL-2001-0128 |
NPARC number | 8933769 |
Export citation | Export as RIS |
Report a correction | Report a correction (opens in a new tab) |
Record identifier | 82d0bf8b-4d98-42ee-8be7-fd815eceda34 |
Record created | 2009-04-23 |
Record modified | 2020-04-16 |
- Date modified: