Download | - View accepted manuscript: Polymer peel-off mask for high-resolution surface derivatization, neuron placement and guidance (PDF, 9.8 MiB)
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DOI | Resolve DOI: https://doi.org/10.1002/bit.24887 |
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Author | Search for: Martinez, Dolores1; Search for: Py, Christopher1; Search for: Denhoff, Mike1; Search for: Monette, Robert1; Search for: Comas, Tanya1; Search for: Krantis, Anthony1; Search for: Mealing, Geoffrey1 |
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Affiliation | - National Research Council of Canada. Information and Communication Technologies
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Format | Text, Article |
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Subject | chemical patterning; process guidance; dry lift-off; neural network |
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Abstract | We present a dry lift-off method using a chemically resistant spin-on plastic, polyimide, to pattern surfaces with high accuracy and resolution. Using well-known lithographic and reactive ion etching techniques, the spin-on polymer is patterned over a silicon dioxide surface. The plastic efficiently adheres to the silicon dioxide surface during the chemical modification and is readily lifted-off following the derivatization process, permitting highly reliable surface derivatization. The verticality of the reactive ion etch enables sub-micrometer features to be patterned, down to 0.8μm. The technique is used to pattern neurons on silicon dioxide surfaces: efficient neuron placement over a 4mm area is shown for patterns larger than 50μm while process guidance is shown for 10μm patterns. |
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Publication date | 2013-05-29 |
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In | |
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Language | English |
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Peer reviewed | Yes |
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NPARC number | 21270703 |
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Export citation | Export as RIS |
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Report a correction | Report a correction (opens in a new tab) |
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Record identifier | 5f776607-e59c-47e8-9e25-d6d65854d521 |
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Record created | 2014-02-17 |
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Record modified | 2020-06-04 |
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