The influence of processing parameters on TLP joining of Inconel 617 alloy

AuthorSearch for: ; Search for: ; Search for: ; Search for:
ConferenceSecond International Symposium on Aerospace Materials: Development, Testing and Life Cycle Issues - Honoring William Wallace, COM 2004, pp.263-274, Aug. 22-25, 2004 From 08/22/2004 To 08/25/2004., Hamilton / Canada
SubjectInconel 617; Transient liquid phase bonding; microstructure control
AffiliationNRC Institute for Aerospace Research; National Research Council Canada
Access conditionavailable
Peer reviewedYes
NRC numberAMTC-2005-0047
NPARC number8930202
Export citationExport as RIS
Report a correctionReport a correction
Record identifier5f22b33b-bb1a-4385-b0f3-d891a3854fd6
Record created2009-04-23
Record modified2016-05-09
Bookmark and share
  • Share this page with Facebook (Opens in a new window)
  • Share this page with Twitter (Opens in a new window)
  • Share this page with Google+ (Opens in a new window)
  • Share this page with Delicious (Opens in a new window)
Date modified: