| Download | - View accepted manuscript: Numerical modeling of hot embossing process for manufacturing of microcomponents (PDF, 4.1 MiB)
|
|---|
| Author | Search for: Kabanemi, K. K.1; Search for: Marcotte, J. P.1; Search for: Hétu, J. F.1; Search for: Worgull, M.; Search for: Heckele, M. |
|---|
| Affiliation | - National Research Council of Canada. NRC Industrial Materials Institute
|
|---|
| Format | Text, Article |
|---|
| Abstract | Hot embossing is a compression molding technique used for high replication accuracy of small features. One of the most sensitive phases of the process is the de-embossing stage during which the patterned part has to be demolded. In this paper, the demolding stage is considered as a frictional contact problem between a rigid mold insert and a viscoelastic polymer sheet as it deforms and cools inside a mold under an applied force. The contact is modeled with a modified Coulomb's law of dry friction while a generalized Maxwell model is used to describe the polymer behavior during embossing, cooling and de-embossing stages. The heat transfer between the mold insert and the patterned polymer sheet is solved through a domain decomposition method. A finite element approximation based on a penalized technique is proposed and analyzed. The purpose of this modeling approach is to predict dimensional stability and residual shape of microcomponenets in the hot embossing process. Such a prediction will allow one to assign appropriate processing conditions that minimize geometrical imperfections and increase replication accuracy. |
|---|
| Publication date | 2007-01-01 |
|---|
| In | |
|---|
| Language | English |
|---|
| Peer reviewed | Yes |
|---|
| NRC number | NRCC 50596 |
|---|
| NPARC number | 15859842 |
|---|
| Export citation | Export as RIS |
|---|
| Report a correction | Report a correction (opens in a new tab) |
|---|
| Record identifier | 5aecf7d4-aea1-43a7-a234-15b125621a2a |
|---|
| Record created | 2010-07-30 |
|---|
| Record modified | 2020-05-10 |
|---|
