Laser-assisted etching for micropatterning of InP

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Proceedings titleLaser-induced thin film processing : 8-10 February 1995, San Jose, California
Series titleProceedings of SPIE; Volume 2403
ConferenceLaser-induced thin film processing: 8-10 February 1995, San Jose, California, USA
Pages414424; # of pages: 11
AbstractWe report on XeCl excimer (308 nm) laser-assisted dry etching ablation (LADEA) of InP in a Cl2/He atmosphere. The InClx layer produced by the chlorination process was ablated for laser fluences below 80 mJ/cm2; this was determined to be the ablation threshold of InP for our experimental conditions. We studied the influence of Cl2/He mixture pressure, laser fluence and number of pulses on the etch rate of InP. Experiments were carried out with 5% and 10% concentrations of chlorine and at a laser repetition rate of 5 Hz. Employing linearly polarized light with an appropriate choice of experimental parameters (based on the afore mentioned studies), gratings were patterned by laser-induced coherent modulation of the beam at the semiconductor surface. We have also, for the first time, combined diffraction with LADEA to develop regular shaped features on semiconductor surfaces. Using this technique, 0.3-0.5 micrometers gratings were developed on the InP surfaces by an array of rectangular apertures. This approach offers the potential for fabrication of damage-free micro- or nano-structures, as well as substrates with patterns suitable for selective area deposition/epitaxy.
Publication date
PublisherSPIE--the International Society for Optical Engineering
AffiliationNational Research Council Canada; NRC Institute for Chemical Process and Environmental Technology
Peer reviewedNo
NPARC number12327307
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Record identifier25ffa6b7-3ed4-43e9-bf0f-7f5d96852b05
Record created2009-09-10
Record modified2017-09-13
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