Microstructural evolution during transient liquid phase bonding of Inconel 617 alloy using Ni-filler wire
Microstructural evolution during transient liquid phase bonding of Inconel 617 alloy using Ni-filler wire
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Affiliation |
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Format | Text, Article |
Subject | TLP Bonding; Superalloys; Engine components |
Access condition |
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NRC number | AMTC-2008-0030 |
NPARC number | 9076998 |
Export citation | Export as RIS |
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Record identifier | 174b9c32-d96c-493f-9955-6621e3cafe97 |
Record created | 2009-06-02 |
Record modified | 2020-04-16 |
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