A Heat Transfer Model for the Production of Semi-Solid Billets With the SEED Process

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ConferenceThe 10th International Conference on Aluminum Alloys (ICAA - 10), July 9-13, 2006, Vancouver, Canada
SubjectSemi-solid aluminium; SEED; heat transfer coefficient; inverse heat conduction; empirical model; numerical simulations
Publication date
AffiliationNational Research Council Canada; NRC Industrial Materials Institute
Peer reviewedNo
NRC number48865
NPARC number12884454
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Record identifier10a1810a-4126-4545-ae36-159b7cb4b61d
Record created2009-11-06
Record modified2016-05-09
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