High-quality hole drilling in alumina wafers using femtosecond laser

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TypeTechnical Report
Series titleIMI Series; no. 2008-118314-G
Physical description20 p.: ill.
SubjectAl2O3; femtosecond laser; via holes drilling
AbstractThe topography, radial spreading and chemical composition of the slag produced during percussion and trepanning hole drilling process using femtosecond laser have been investigated. Results on optical microscopy, electron scanning microscopy and energy dispersion spectroscopy analysis are presented. While there is no significant difference in the average ablation rate between the near IR femtosecond laser in comparison to the UV nanosecond laser ablation of Al2O3 ceramics, near IR femtosecond laser provides better precision and quality. Absence of particulates due to resolidification of molten material around the hole was also observed. The slag consisted of ultrafind powder formed by the condensation of the supersaturated ablation plume. This slag can easily be removed using ultrasonic bath with the mixture of acetone and water. Combining the trepanning hole drilling method, femtosecond laser opens up a new door for production of high precision micro via holes in alumina wafers.
Publication date
PublisherNational Research Council of Canada. Industrial Materials Institute
AffiliationNRC Industrial Materials Institute; National Research Council Canada
Peer reviewedNo
NRC number49166
NPARC number21274374
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Record identifier06125714-ba19-4245-93f7-b378529755f7
Record created2015-03-11
Record modified2016-10-03
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