In situ monitoring of process-induced residual stresses of composites bonding using DMA -- ABSTRACT ONLY

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ConferenceICCM-16(the sixteenth international conference on composite materials) From 7/8/2007 To 7/13/2007, Kyoto, Japan
SubjectDynamic Mechanic Analysis (DMA); Warpage; Residual Stresses; Cure; Composites
AffiliationNRC Institute for Aerospace Research; National Research Council Canada
Access conditionavailable
Peer reviewedYes
NRC numberSMPL-2006-0120
NPARC number8927354
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Record identifier0277f4a7-5e62-4092-967d-b51904bd8d23
Record created2009-04-23
Record modified2016-05-09
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