In situ monitoring of process-induced residual stresses of composites bonding using DMA -- ABSTRACT ONLY
In situ monitoring of process-induced residual stresses of composites bonding using DMA -- ABSTRACT ONLY
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Affiliation |
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Format | Text, Article |
Conference | ICCM-16(the sixteenth international conference on composite materials) From 7/8/2007 To 7/13/2007, Kyoto, Japan |
Subject | Dynamic Mechanic Analysis (DMA); Warpage; Residual Stresses; Cure; Composites |
Access condition |
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Peer reviewed | Yes |
NRC number | SMPL-2006-0120 |
NPARC number | 8927354 |
Export citation | Export as RIS |
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Record identifier | 0277f4a7-5e62-4092-967d-b51904bd8d23 |
Record created | 2009-04-23 |
Record modified | 2020-04-16 |
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