| Download | - View accepted manuscript: High fidelity, high yield production of microfluidic devices by hot embossing lithography : Rheology and stiction (PDF, 773 KiB)
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| DOI | Resolve DOI: https://doi.org/10.1039/b600584e |
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| Author | Search for: Cameron, Neil S.1; Search for: Roberge, Helene1; Search for: Veres, Teodor1; Search for: Jakeway, Stephen C.; Search for: Crabtree, H. John |
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| Affiliation | - National Research Council of Canada. NRC Industrial Materials Institute
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| Format | Text, Article |
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| Abstract | We discuss thermoforming of thermoplastic polymers for the hot-embossing lithographic (HEL) fabrication of microfluidic chips near equilibrium conditions that minimize elastic recoil for optimal motif replication. While HEL is often simplistically described as the transfer of micro- and nano-motifs into heat-softened thermoplastic materials, we describe our rational approach to selecting appropriate processing parameters. |
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| Publication date | 2006-04-21 |
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| In | |
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| Language | English |
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| Peer reviewed | Yes |
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| NRC number | NRCC 48856 |
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| NPARC number | 15878011 |
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| Export citation | Export as RIS |
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| Report a correction | Report a correction (opens in a new tab) |
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| Record identifier | 00b6b34d-77c7-4908-9e3c-d6462590050e |
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| Record created | 2010-07-30 |
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| Record modified | 2020-04-22 |
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